| TR-5917A Conductor TR-5917A为一种无铅银钯胶，重要利用于晶片电阻器。利用先进的金属粉末技术与熔塊混合系统，产出优质的黏着个性。 | |
| 个性FEATURES | |
| 金属组成 (Metal Alloy) | 99.5 Ag / 0.5 Pd |
| 金属含量 (Target Metal Content) | 72.50% |
| 固体含量 (Solid Content) | 77% ± 2% |
| 推荐工艺RECOMMENDED PROCESSING | |
| 印 刷 (Printing) | 325 mesh stainless steel screen |
| 干燥燥 (Drying) | 150℃,3 min |
| 烧成 (Firing) | 850℃,8~10 min (for peak-temperature) |
| 总共烧成功夫45~60 min | |
| 黏度 (Viscosity) | 220± 20k cps. |
| (Brookfield, HBT DVll, SC4-14 | |
| 10r.p.m. at 25℃) | |
| 稀释剂 (Thinner) | T-307 |
| 存储功夫 (Shelf life) | 6 months in sealed container (20℃ ± 5℃) |
| 备注 (Remark) | 现实规格以产品认可书为主 |
| TR-5917B1 Conductor | |
| TR-5917B1为一种无铅银钯混合物，重要使用于低温系数晶片电阻器。利用银粉以特殊熔塊系统产出胶膜，于熔烧及电镀后产出其优质黏着个性。 | |
| 特点 FEATURES | |
| 金属组成 (Metal Alloy) | 99.5 Ag / 0.5 Pd |
| 金属含量 (Target Metal Content) | 72.5% ± 2% |
| 固体含量 (Solid Content) | 78.2% ± 2% |
| 推荐工艺RECOMMENDED PROCESSING | |
| 印 刷 (Printing) | 325 mesh stainless steel screen |
| 干燥 (Drying) | 150℃,3~5 min |
| 烧成 (Firing) | 850℃,8~10 min (for peak-temperature) |
| 总共烧成功夫35~45 min | |
| 黏度 (Viscosity) | 200~240k cps. |
| (Brookfield, HBT DV-E, SC4-14 | |
| 10rpm at 25℃) | |
| 稀释剂 (Thinner) | T-301 |
| 贮存功夫 (Shelf life) | 6 months in sealed container (5℃~30℃) |
| 备注 (Remark) | 现实规格以产品认可书为主 |
| TR-5932S Conductor | |
| TR-5932S为一种无铅纯银导电胶，重要使用于幼尺寸晶片电阻器。它利用银粉以特殊熔塊系统产出优质黏性以及抵抗氧化铝基板上的酸性个性。 | |
| 特点FEATURES | |
| 金属組成 (Metal Alloy) | 100% Ag |
| 金属含量 (Target Metal Content) | 55% |
| 固体含量 (Solid Content) | 59.5% ± 2% |
| 推荐工艺RECOMMENDED PROCESSING | |
| 印 刷 (Printing) | 400 mesh stainless steel screen |
| 干燥 (Drying) | 150℃,3 min |
| 烧成 (Firing) | 850℃,10~12 min (for peak-temperature) |
| 总共烧成功夫45~60 min | |
| 黏度 (Viscosity) | 180 ± 20k cps. |
| (Brookfield, HBT DVll, SC4-14 | |
| 10r.p.m. at 25℃) | |
| 稀释剂 (Thinner) | T-301 |
| 贮存功夫 (Shelf life) | 6 months in sealed container (5 ~ 30℃) |
| 备注(Remark) | 现实规格以产品认可书为主 |
GA黄金甲（ NEXTECK ）的各项产品都获得长年的实积和信任。用于半导体及电子零件的各类商标十吩祀全，对应形形色色的成形步骤，拥有优良的成形性与尺寸精确度。